无研磨介质分散技术

Milling Media-Free Dispersion

In order to obtain higher shear of conventional milling process, smaller beads with 0.03mm are utilized at beads milling process. Users are facing higher operation and maintenance cost.

It was observed that particle size and particle size distribution are similar by beads milling process and N seris high pressure homogenization, but it was found that device made by milling process with significant impurity which caused by millingbeads,movable parts and chamber lining.

Pressurized product into high shear chambers without any milling media inside, diamond is used to be wear-resistant material, better control the impurity generated at processing. performance is proven widely to be used for nano-dispersion, high pressure homogenization, deagglomeration, encapsulation and cell disruption

无研磨介质分散技术

传统研磨工艺为获得更高剪切力，会使用0.03毫米的微珠。用户不得不承担更高的运营和维护成本。

实验数据显示，珠磨工艺与N系列高压均质在颗粒粒径和分布方面效果相近，但珠磨设备因研磨介质、活动部件和腔体内衬会导致明显杂质污染。

通过高压将物料送入高剪切反应腔，腔内完全无研磨介质，并采用耐磨钻石材质，能更好地控制加工过程中的杂质生成。其性能已广泛验证适用于纳米分散、高压均质、解团聚、包覆和细胞破碎等工艺。